Skip to product information
1 of 1

BGA Solder Spheres Sn96.5.Ag3.Cu0.5 - LF solder balls 99.9% sphericity

BGA Solder Spheres Sn96.5.Ag3.Cu0.5 - LF solder balls 99.9% sphericity

Regular price $126.99 USD
Regular price Sale price $126.99 USD
Sale Sold out
Size
BGA Packaging

BGA Solder Spheres Sn96.5/Ag3/Cu0.5 (SAC305)

– Made from virgin materials – 99.95% pure
– Oxide-free, conflict-free
– Perfectly round – over 95% spheres have 99.95% sphericity
– Complies with IPC-JSTD-006 requirements

Manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages.

Exceed both the IPC and MIL standards for purity levels and size tolerances.

Nominal sizes from 3 mil to 45 mil, and custom solder sphere sizes are also available upon request.

Many alloys are available for use in solder spheres, including several lead-free alternatives.

Available packaging - 25K & 250K bottles, 500k & 1M jars

Size Distribution

99% of the spheres are within the size range: +/- 0.0005"
99.95% of the spheres are within the size range: +/- 0.001"

Sphericity

99.95% of the spheres exceed 95% roundness factor.

Safety Notice

This product is intended for professional audience. Information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process. Manufacturer or distributors will assume no liability for results obtained or damages incurred through the application of the data presented.

View full details

Modern Surface Mounting Technology for the era of unmanned vehicles and space travels

Made in the USA to the applicable industry standards 100% customer satisfaction guaranteed!